Advanced Chip Packaging Seminar, 6 June 2024
On Thursday 6 June, S3B and the Advanced Manufacturing Research Facility (AMRF) co-hosted the Advanced Chip Packaging seminar in anticipation of the launch of AMRF Building 2.
Experts from across the industry came together to discuss ideas, raise potential challenges and look to the opportunities this new facility will unlock for advanced manufacturing capabilities in Australia.
We heard from Nadia Court (S3B), Ben Kitcher (AMRF), Madhu Jambunathan (S3B), Dr Wei-Chung Lo (Industrial Technology Research Institute, Taiwan). The panel discussion was chaired by Simon Ruffell (Archer Materials Limited) in conversation with Tara Hamilton (Cuvos, Advanced PS Clocking), Chris Escott (Diraq), Xiaoke Yi (USYD) and Sarah Sharp (Frontier Sensing).
All sessions of the seminar are available to watch and share on YouTube.
