APPLICATIONS NOW CLOSED
Call for Expressions of Interest: MPW and CAD Access Subsidy
S3B invites expressions of interest for Round 4 of the Semiconductor Innovation Fund: MPW & CAD Subsidy, an initiative supporting access to advanced CAD and EDA tools and fabrication services for Australian semiconductor projects.
This initiative enables start-ups, researchers, and companies to prototype and validate devices with the backing of international partners and coordination by S3B. The program offers subsidised access to Multi-Project Wafer (MPW) runs and cloud-based CAD design environments and licensing, helping to accelerate ASIC development, hardware innovation, testing, and packaging.
Working in collaboration with global fabrication providers including, but not limited to, CMC Microsystems, Europractice, MUSE Semi, and Pragmatic Semiconductor, S3B will coordinate MPW tape-outs across multiple technology nodes.
If you are planning to tape out in 2026 and your project aligns with the program criteria, we encourage you to submit an expression of interest by 5:00 pm AEST, 3 April 2026. – APPLICATIONS CLOSED
To apply, complete the following steps:
- Apply for free individual or institutional S3B membership
- Ensure your project aligns with the guidelines and criteria (outlined below)
- Submit an expression of interest form by 5:00pm, 3 April 2026
- Shortlisted applications may be invited to participate in a subsequent meeting regarding project timelines and details
S3B serves as a broker, coordinating access on behalf of Australian stakeholders and unlocking new opportunities for collaboration, capability development, and commercial impact within the global semiconductor supply chain.
1. Services information
CAD/EDA Tool Licensing and Cloud features
The applicant can apply for up to 50% of the licensing cost for EDA or CAD tools. S3B can help facilitate connections with common tool vendors such as Cadence and Synopsys.
CAD cloud access will be primarily provided through CMC Microsystems irrespective of the MPW fabrication partner. CMC Microsystems is a Cadence Cloud Passport partner and provides tools for design, layout, and analysis of ASIC and PCB designs. Other leading-edge technologies can also be accessed on the cloud through CMC’s cloud services. CMC will provide a fully configured, installed, and maintained environment with continuous software updates to reduce administration costs and accelerate the design process.
Please see CMC website for further features and licensing requirements and costs.
Additional services (but not limited to):
- License server setup and support
- Software installation and updates
- Select PDK installation and updates
- Custom script and framework development
MPW offerings:
Through fabrication partners, we coordinate multi-project wafer services and related fabrication services across a variety of technologies. Technology selection and cost indications can be viewed online from the CMC or Europractice websites, listed in the following sections.
2. CAD/EDA Licensing and Cloud ACCESS COST
The CAD cloud environment and support cost approximately $4,600 per year for academic groups with up to a maximum of 50 users. Industry and start-up CAD cloud environment and support options are also available. Please contact S3B for estimated costs.
Typical spending on public cloud (AWS) credit is roughly $3,700 per year.
3. partners information
MPW cost indications from:
- CMC
- Europractice
- MUSE Semi
S3B can also facilitate engagement with new partners in accordance with the interests of applicants.
The cost of the MPW runs depends on the die area and the technology node. Please refer to partner websites for more information about costing.
4. Funding Guidelines & Eligibility Criteria
- Applicants may request up to a 50% subsidy for any single MPW run (capped at 20 mm² per MPW and 10 mm² per stakeholder) or for CAD/EDA licensing costs.
- Applicants may request up to a 100% subsidy for accessing the cloud-hosted CAD environment. Applicants will be responsible for any additional costs, including CAD licences and AWS usage.
Open to organisations across Australia with a valid ABN.
Signing your funding agreement
You must sign your funding agreement within six (6) months from the date of the written offer. During this time, we will work with you to finalise the details. If you do not sign the funding agreement within six (6) months from the date of the written offer, we have the right to withdraw from the negotiation and the offer will lapse.
5. Assessment criteria
Applications will be assessed against the following criteria:
- Project novelty, impact, and alignment with National Reconstruction Fund priority areas.
- Demonstration of ecosystem impact through collaboration, development of new capability, use of local infrastructure, and talent development.
- Demonstration that the Multi-Project Wafer or CAD/EDA tool access subsidy will meaningfully impact the project in a way not currently possible through other subsidies or grants.
6. Expression of Interest
Applications for Round 4 are now now closed.
