Semiconductor Innovation Fund: MPW & CAD Subsidy Round 3

Call for Expressions of Interest: MPW and CAD Access Subsidy

S3B invites expressions of interest for Round 3 of the Semiconductor Innovation Fund: MPW & CAD Subsidy, an initiative supporting access to advanced design tools and fabrication services for Australian semiconductor projects.

This initiative enables startups, researchers, and companies to prototype and validate devices with the backing of international partners and S3B coordination. The program offers subsidised access to Multi Project Wafer (MPW) runs and cloud-based CAD design environments, designed to accelerate ASIC development, hardware innovation, and commercialisation.

Working in collaboration with global fabrication providers such as CMC Microsystems, Europractice, MUSE Semi, and Pragmatic Semiconductor, S3B will coordinate MPW tape-outs across multiple technology nodes.

If you are planning to tape out in 2025 and your project aligns with the program criteria, we encourage you to submit an expression of interest by 5.00pm AEST, 30 May 2025.

To apply, complete the following steps:

1. Apply for free individual or institutional S3B membership
2. Ensure your project aligns to the guidelines and criteria (outlined below) 
3. Submit an expression of interest form by 5pm, 30 May 2025
4. Shortlisted applications will be invited to participate in a subsequent meeting regarding project timelines and details

S3B serves as a broker, coordinating access on behalf of Australian stakeholders and unlocking new opportunities for collaboration, capability development, and commercial impact within the global semiconductor supply chain.

1. Services information 

CAD Cloud features  

CAD cloud access will be primarily from CMC Microsystems irrespective of the MPW fabrication partner. CMC Microsystems is a Cadence Cloud Passport partner and provides tools for design, layout, and analysis of ASIC and PCB designs. Other leading-edge technologies can also be accessed on the cloud through CMC’s Cloud service. CMC will provide fully configured, installed, and maintained environment continuous software updates to reduce administration costs and accelerate design process. Please see website for further features and licensing requirements and costs.

Additional services (but not limited to): 

• License server setup and support  

• Software installation and updates  

• Select PDK installation and updates

• Custom script and framework development

MPW offerings: 

Through fabrication partners, we coordinate multi-project wafer services and related fabrication services in a variety of technologies. Technology selection and cost indication can be viewed online from the CMC or Europractice website listed in the appendix. 

2. CAD Cloud and Fabrication costs and partners information  

• MPW cost indication from CMC
• MPW cost indication from Europractice
• MPW cost indication from MUSE Semi 
• CAD cloud environment and support is ~$4600 per year for academic groups up to a maximum of 50 users. Industry/startup CAD cloud environment and support is also available. Please contact S3B for estimated costs. 
• Typical spend on public cloud (AWS) credit is roughly $3700 per year. 
• CAD Licences and AWS costs are the responsibility of the applicant. 
• Australian startups are also entitled to participate in CMC Microsystems Virtual Incubator Environment (VIE) for CAD and simulation tool access –Virtual Incubator Environment (VIE) for Startups – CMC Microsystems 

3. Funding Guidelines & Eligibility Criteria 

• S3B will coordinate and subsidise two MPW runs per year with the EOI opening in May and December each year until end of 2026. 
• Applicants may request up to 50% subsidy for any single MPW run (capped at 20mm2 per MPW, 10mm2 per stakeholder).  
• Applicants may request up to 100% subsidy for accessing the cloud hosted CAD environment. Applicants will be responsible for the additional costs including CAD licences and AWS.  
• Open to organisations Australia-wide. 

4. Assessment criteria  

Applications will be assessed against the following criteria:  

• Project novelty, impact, and alignment to National Reconstruction Fund priority areas.
• Demonstration of ecosystem impact through collaboration, development of new capability, use of local infrastructure, talent development etc. 
• Demonstration that the Multi Project Wafer and CAD access subsidy will have an impact on your project in a way that is not currently available, through access to other subsidies or grants.  
• Demonstrate that the project will have a clear pathway to commercialisation.

5. Expression of Interest

Applications for Round 3 are now closed.