Company Overview
Sydney-based startup Syenta, established in 2022, specialises in providing innovative and scalable multi-material deposition solutions tailored for advanced chip packaging applications. With proprietary technologies that enable precise 3D patterning and deposition of electronic interconnects, Syenta transforms traditional manufacturing processes by reducing costs, environmental impact, and the complexity of production.
By leveraging cutting-edge advancements in materials science and fabrication, Syenta’s platform reduces overall process steps required for advanced chip packaging, providing high-efficiency solution with minimal investment. Their commitment to innovation positions Syenta as a key player in the evolution of sustainable semiconductor equipment makers.
Challenge
Syenta faced a multifaceted challenge in fabricating precise stamps required for localised electro-modelling experiments. These stamps featured a central design on a 2″ wafer, necessitating both technical precision and cost-effective solutions. The primary hurdles included:
- Identifying commercial fabrication facilities capable of delivering small-scale, timely, and cost-efficient results.
- Resolving technical issues in metal deposition and thicker polymer patterning after initial trials were unsuccessful.
- Exploring and sourcing suitable substrates, such as Through Glass Via (TGV)-processed substrates, for prototype trials.
- Assessing end-to-end redistribution layer (RDL) processes to optimize costs and operational efficiency.
These challenges required Syenta to explore diverse fabrication partners and refine its technical approach while adhering to strict timelines.
How S3B Supported Syenta
S3B provided Syenta with targeted support and guidance, helping them address their challenges effectively through the following actions:
- Facilitation of Commercial Fab Engagements:
- S3B connected Syenta with several commercial fabs known for microfabrication of photolithography stamps, including Silex Microsystems, MEMS Exchange, Teledyne MEMS, and Eulitha, among others.
- A shortlist of recommended fabs was provided, prioritising those with the capabilities to handle Syenta’s specific patterning needs for the 2″ wafer.
- Technical Support for Metal Deposition and Polymer Patterning:
- S3B facilitated collaboration with the Research Prototype Foundry (RPF) to resolve the issues encountered during earlier trials. This ensured alignment on technical processes and timelines, resulting in successful fabrication of polymer stamps critical to Syenta’s experiments.
- Provision of Metrics and Cost Insights:
- S3B provided detailed cost and process insights for an end-to-end RDL solution, leveraging established industry benchmarks. This enabled Syenta to plan its resources effectively and optimise operational strategies.
- TGV-Processed Substrates for Prototype Trials:
- S3B sourced high-quality TGV-processed substrates essential for localised electro-modelling prototypes, ensuring reliable performance and advancing Syenta’s research objectives.
Results and Next Steps
Through S3B’s targeted guidance and industry connections, Syenta achieved significant milestones, including:
- Securing partnerships with commercial fabs tailored to their specific fabrication needs.
- Overcoming technical challenges in polymer patterning and metal deposition, with successful outcomes delivered via RPF collaboration.
- Accessing premium TGV-processed substrates, advancing prototype trials for localized electro-modelling applications.
- Gaining actionable insights into RDL process costs, enabling informed decision-making and efficient resource allocation.
Syenta’s collaboration with S3B has significantly enhanced their prototype development, setting the stage for continued innovation in large scale localised electro- modelling.
Testimonial
“S3B has been an invaluable partner in helping Syenta navigate critical challenges in our fabrication journey. Their support in identifying local fabs for stamp fabrication, providing fabrication assistance at RPF, and offering budget estimates for RDL and TGV substrates, among other areas, has been instrumental in advancing our work. The expertise, support and guidance from S3B have enabled us to overcome hurdles and stay on track with our development goals,” Dr. Jekaterina Viktorova, Founder/CEO, Syenta.
