Semiconductor Sector Service Bureau


Invitation for EOI: Multi Project Wafer and CAD cloud access subsidy

06th May 2024

Invitation for EOI: Multi Project Wafer and CAD cloud access subsidy

The Semiconductor Sector Service Bureau (S3B) is inviting expressions of interest to participate in a Multi Project Wafer (MPW) and CAD cloud access subsidy coordinated with international fabrication partners.

This is an unprecedented opportunity to work in collaboration with S3B to access tailored MPW and CAD services that are specific to your project needs.

Working with international partners such as CMC Microsystems, Europractice and Pragmatic Semiconductor, S3B will be coordinating tape outs for various technology nodes through 2024 and 2025.

There are four steps to apply to get access to the MPW and CAD cloud access subsidy:

  1. Apply for free individual or institutional membership to S3B: Become a member.
  2. Ensure your project aligns to the guidelines and criteria.
  3. Submit an expression of interest form.
  4. Shortlisted applications will be invited to participate in a subsequent meeting regarding project timelines and details.

The Semiconductor Service Bureau aims to serve as a broker on behalf of numerous Australian projects, facilitating access to the vast potential of collective relationships within the semiconductor supply chain. The MPW and CAD cloud access subsidy aligns with our strategy to promote semiconductor activities in the region.

If you have plans to tape out in 2024 or 2025 or are working on a project which meets the criteria, please submit an EOI by 5pm, 7 June 2024. Applications will be considered for any of the technologies available via our partners imec.IC-link, Europractice, CMC Microsystems and other approved fabrication service providers such as Win Semiconductors, MUSE Semiconductor, etc.

1. Services information

CAD Cloud features
CAD cloud access will be primarily from CMC Microsystems irrespective of the MPW fabrication partner.  CMC Microsystems is a Cadence Cloud Passport partner and provides tools for design, layout, and analysis of ASIC and PCB designs. Other leading-edge technologies can also be accessed on the cloud through CMC’s Cloud service. CMC will provide fully configured, installed and maintained environment continuous software updates to reduce administration costs and accelerate design process. Please see website for further features and licensing requirements and costs.

Additional services (but not limited to):

  1. License server setup and support
  2. Software installation and updates
  3. Select PDK installation and updates
  4. Custom script and framework development

MPW offerings
Through fabrication partners, we coordinate multi-project wafer services and related fabrication services in a variety of technologies. Technology selection and cost indication can be viewed online from the CMC or Europractice website listed in the appendix.

2. CAD Cloud and Fabrication costs and partners information
  • MPW cost indication from CMC
  • MPW cost indication from Europractice
  • MPW cost indication from MUSE Semi
  • CAD cloud environment and support is ~$4600 per year for academic groups up to a maximum of 50 users. Industry/startup CAD cloud environment and support is also available. Please contact S3B for estimated costs.
  • Typical spend on public cloud (AWS) credit is roughly $3700 per year.
  • CAD Licences and AWS costs are the responsibility of the applicant.
3. Funding Guidelines & Eligibility Criteria
  1. S3B will initially co-ordinate and subsidise three MPW runs (2 x TSMC 180nm and one Pragmatic Flex IC) with the first one planned for Q4, 2024.
  2. Depending on demand S3B estimates allocating on average up to $10,000/project with opportunity for higher levels of funding as per point 3 below.
  3. Applicants may request up to 50% subsidy for TSMC 180nm MPW run (capped at 20mm2 per MPW, 10mm2 per stakeholder). Applicants requiring access to more advanced nodes will be considered for higher levels of financial support based on merit and commercial viability.
  4. Applicants may request up to 100% subsidy for accessing the cloud hosted CAD environment. Applicants will be responsible for the additional costs including CAD licences and AWS.
  5. Organisations located outside of NSW must collaborate with an NSW based entity to be eligible for any subsidy.
4. Assessment criteria

Applications will be assessed against the following criteria:

  1. Project novelty, impact, and alignment to national reconstruction fund priority areas.
  2. Demonstration of ecosystem impact through collaboration, development of new capability, use of local infrastructure, talent development etc.
  3. Outstanding proposals may attract higher levels of financial support if they can demonstrate the project is on a path towards commercialisation.
  4. Demonstration that the Multi Project Wafer and CAD cloud access subsidy will have an impact on your project in a way that is not currently available, through access to other subsidies or grants.
  5. Organisation must have a physical presence in NSW or the project is being undertaken in partnership with an organisation headquartered in NSW.
Expression of Interest

Please submit your expression of interest by 5pm, 7 June 2024.

Semiconductor Sector Service Bureau